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PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
Rev. 01 -- 28 March 2006 Product data sheet
1. Product profile
1.1 General description
NPN/NPN double Resistor-Equipped Transistors (RET) in Surface Mounted Device (SMD) plastic packages.
Table 1. Product overview Package Philips PEMH30 PUMH30 SOT666 SOT363 JEITA SC-88 NPN/PNP complement PEMD30 PUMD30 PNP/PNP complement PEMB30 PUMB30
Type number
1.2 Features
I 100 mA output current capability I Built-in bias resistors I Simplifies circuit design I Reduces component count I Reduces pick and place costs
1.3 Applications
I Low current peripheral driver I Control of IC inputs I Cost-saving alternative for BC847BS and BC847BV
1.4 Quick reference data
Table 2. Symbol VCEO IO R1 Quick reference data Parameter collector-emitter voltage output current bias resistor 1 (input) Conditions open base Min 1.54 Typ 2.2 Max 50 100 2.86 Unit V mA k
Per transistor
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
2. Pinning information
Table 3. Pin 1 2 3 4 5 6 Pinning Description GND (emitter) TR1 input (base) TR1 output (collector) TR2 GND (emitter) TR2 input (base) TR2 output (collector) TR1
TR1
Simplified outline
6 5 4
Symbol
6 5 4
R1 TR2
1
2
3
001aab555
R1
1
2
3
sym090
3. Ordering information
Table 4. Ordering information Package Name PEMH30 PUMH30 SC-88 Description plastic surface mounted package; 6 leads plastic surface mounted package; 6 leads Version SOT666 SOT363 Type number
4. Marking
Table 5. PEMH30 PUMH30
[1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
Marking codes Marking code[1] 2S *B1
Type number
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
2 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IO ICM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage output current peak collector current total power dissipation SOT363 SOT666 Per device Ptot total power dissipation SOT363 SOT666 Tj Tamb Tstg
[1] [2]
Conditions open emitter open base open collector single pulse; tp 1 ms Tamb 25 C
[1] [1][2]
Min -
Max 50 50 5 100 100
Unit V V V mA mA
Per transistor
-
200 200
mW mW
Tamb 25 C
[1] [1][2]
-65 -65
300 300 150 +150 +150
mW mW C C C
junction temperature ambient temperature storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient SOT363 SOT666 Per device Rth(j-a) thermal resistance from junction to ambient SOT363 SOT666
[1] [2]
Conditions in free air
[1] [1][2]
Min
Typ
Max
Unit
Per transistor
-
-
625 625
K/W K/W
in free air
[1] [1][2]
-
-
416 416
K/W K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method.
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
3 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO ICEO Parameter collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current DC current gain collector-emitter saturation voltage bias resistor 1 (input) collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz Conditions VCB = 50 V; IE = 0 A VCE = 30 V; IB = 0 A VCE = 30 V; IB = 0 A; Tj = 150 C VEB = 5 V; IC = 0 A VCE = 5 V; IC = 20 mA IC = 10 mA; IB = 0.5 mA Min 30 1.54 Typ 2.2 Max 100 1 50 100 150 2.86 2.5 mV k pF Unit nA A A nA Per transistor
IEBO hFE VCEsat R1 Cc
500 hFE
(1)
006aaa696
1
006aaa697
400
VCEsat (V)
(2)
300
10-1 200
(3)
(1) (2) (3)
100
0 10-1
1
10 IC (mA)
102
10-2 10-1
1
10 IC (mA)
102
VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C
IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -40 C
Fig 1. DC current gain as a function of collector current; typical values
Fig 2. Collector-emitter saturation voltage as a function of collector current; typical values
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
4 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
8. Package outline
2.2 1.8 6 5 4 0.45 0.15 1.1 0.8 6
1.7 1.5 5 4 0.3 0.1
0.6 0.5
2.2 1.35 2.0 1.15
pin 1 index
1.7 1.5
1.3 1.1 pin 1 index
1 0.65 1.3 Dimensions in mm
2
3 0.3 0.2 0.25 0.10 04-11-08 Dimensions in mm
1 0.5 1
2
3 0.27 0.17 0.18 0.08 04-11-08
Fig 3. Package outline SOT363 (SC-88)
Fig 4. Package outline SOT666
9. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description PEMH30 PUMH30 SOT666 SOT363 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2
[1] [2] [3]
[2] [3]
Packing quantity 3000 4000 8000 10000 -115 -125 -115 -315 -135 -165
For further information and the availability of packing methods, see Section 13. T1: normal taping T2: reverse taping
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
5 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
10. Soldering
2.65 0.60 (2x)
2.35
0.40 0.90 2.10 (2x) 0.50 (4x)
solder paste solder lands solder resist occupied area
0.50 (4x)
1.20 2.40
MSA432
Dimensions in mm
Fig 5. Reflow soldering footprint SOT363 (SC-88)
5.25
4.50
0.30 1.00 4.00
solder lands solder resist occupied area 1.15 3.75 transport direction during soldering
sot363
Dimensions in mm
Dimensions in mm
Fig 6. Wave soldering footprint SOT363 (SC-88)
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
6 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
2.75 2.45 2.10 1.60 0.15 (4x) 0.40 (6x) 2.00 1.70 1.00 0.55 (2x) 0.30 (2x) 0.375 (4x)
1.20 2.20 2.50 solder lands placement area occupied area
0.075
solder resist
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 7. Reflow soldering footprint SOT666
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
7 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
11. Revision history
Table 10. Revision history Release date 20060328 Data sheet status Product data sheet Change notice Supersedes Document ID PEMH30_PUMH30_1
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
8 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
PEMH30_PUMH30_1
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 01 -- 28 March 2006
9 of 10
Philips Semiconductors
PEMH30; PUMH30
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k, R2 = open
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 Packing information. . . . . . . . . . . . . . . . . . . . . . 5 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 28 March 2006 Document identifier: PEMH30_PUMH30_1

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